EE Times writes TSMC has decided to expand their CAPEX for to develop their 45 nm and 40 nm processing technologies. Some of the CAPEX will also be used to upgrade their equipment. EE Times writes:
The board of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has approved a $795 million capital spending plan that includes a push into 45-/40-nm CMOS processes and MEMS.
The spending is part of TSMC's previously-announced capital expenditure budget for 2008. For year 2008, total capital expenditures for TSMC is expected to be around $1.8 billion, compared with $2.6 billion spent in 2007.
On the leading-edge front, silicon foundry giant TSMC said it has approved the appropriations of $687.60 million to expand its 45- and 40-nm manufacturing capacity within its 300-mm fabs. TSMC recently rolled out these processes.
The company has also approved capital appropriations of $107.40 million in 200-mm fab equipment. It will upgrade a portion of its 0.18-micron logic process capacity to 0.11-micron CMOS image sensor technology, 0.11-micron logic, 0.13-micron high voltage, and 0.18-micron RF.
EE Times also notes TSMC's expansion into the Microelectromechanical System (MEMS) fabrication (we previously commented on this in Taiwan Manufacturers Move into MEMS market). According to EE Times:
In addition, the appropriation will also be used to upgrade a portion of its 0.35-micron logic process capacity to MEMS processes.
TSMC (Hsinchu) has been involved in MEMS foundry production for some time, but the company is expanding its efforts in the arena--and for good reason: MEMS is growing at an annual rate of 13 percent, according to the company.
Within its fabs, the company is devising several MEMS products on a foundry basis for customers, such as inkjet devices, sensors, RF MEMS and displays. It is developing several processes in the arena, such as bulk MEMS, surface MEMS and a CMOS-MEMS integration technology.
Unsurprisingly UMC, TSMC's main competitor, is also jumping on the MEMS bandwagon.
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